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"The study on failure mechanisms of bond pad metal peeling: Part ..."

Insu Jeon (2003)

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DOI: 10.1016/S0026-2714(03)00213-0

access: closed

type: Journal Article

metadata version: 2020-02-22

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Insu Jeon:
The study on failure mechanisms of bond pad metal peeling: Part B--Numerical analysis. Microelectron. Reliab. 43(12): 2055-2064 (2003)

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