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"Development of thermal shock-resistant of GaN/DBC die-attached module by ..."
Dongjin Kim et al. (2018)
- Dongjin Kim
, Chuantong Chen
, Aiji Suetake, Chanyang Choe
, Tohru Sugahara
, Shijo Nagao
, Katsuaki Suganuma:
Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure. Microelectron. Reliab. 88-90: 779-787 (2018)
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