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"Characterization of flip chip bonded structure with Cu ABL power bumps."

Junsung Ma, Sungdong Kim, Sarah Eunkyung Kim (2014)

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DOI: 10.1016/J.MICROREL.2014.03.022

access: closed

type: Journal Article

metadata version: 2020-02-22

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Junsung Ma, Sungdong Kim, Sarah Eunkyung Kim:
Characterization of flip chip bonded structure with Cu ABL power bumps. Microelectron. Reliab. 54(8): 1598-1602 (2014)

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