"Copper wire interconnect reliability evaluation using in-situ High ..."

Amar Mavinkurve et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.026

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type: Journal Article

metadata version: 2022-05-18

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Amar Mavinkurve, Leon Goumans, G. M. O'Halloran, Rene T. H. Rongen, Mark-Luke Farrugia:
Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests. Microelectron. Reliab. 54(9-10): 1661-1665 (2014)

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