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"Thermomechanical deformation of a bimaterial plate--as applied to laminate ..."

Thomas D. Moore, John L. Jarvis (2003)

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DOI: 10.1016/S0026-2714(02)00123-3

access: closed

type: Journal Article

metadata version: 2020-02-22

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Thomas D. Moore, John L. Jarvis:
Thermomechanical deformation of a bimaterial plate--as applied to laminate IC assemblies. Microelectron. Reliab. 43(1): 155-162 (2003)

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