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"Thermal resistance investigations on new leadframe-based LED packages and ..."

B. Pardo et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.02.016

access: closed

type: Journal Article

metadata version: 2021-09-06

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B. Pardo, A. Gasse, A. Fargeix, Jiri Jakovenko, Robert J. Werkhoven, Xavier Perpiñà, Xavier Jordà, Miquel Vellvehí, T. Van Weelden, P. Bancken:
Thermal resistance investigations on new leadframe-based LED packages and boards. Microelectron. Reliab. 53(8): 1084-1094 (2013)

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