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"TCAD modeling for reliability."

Paul Pfäffli et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.109

access: closed

type: Journal Article

metadata version: 2023-09-30

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Paul Pfäffli, Hiu Yung Wong, X. Xu, L. Silvestri, X. W. Lin, T. Yang, Ravi Tiwari, Souvik Mahapatra, Steve Motzny, Victor Moroz, Terry Ma:
TCAD modeling for reliability. Microelectron. Reliab. 88-90: 1083-1089 (2018)

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