"On the assessment of voids in the thermal interface material on the ..."

Bladimir Ramos-Alvarado et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.05.006

access: closed

type: Journal Article

metadata version: 2024-10-06

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Bladimir Ramos-Alvarado, David Brown, Xiuping Chen, Bo Feng, G. P. Peterson:
On the assessment of voids in the thermal interface material on the thermal performance of a silicon chip package. Microelectron. Reliab. 53(12): 1987-1995 (2013)

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