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"Board level solder joint reliability modeling and testing of TFBGA ..."

Tong Yan Tee et al. (2003)

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DOI: 10.1016/S0026-2714(03)00127-6

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong:
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. Microelectron. Reliab. 43(7): 1117-1123 (2003)

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