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"Toward Ultrasonic Wire Bonding for High Power Device: A Vector Based ..."

Shuyuan Ye et al. (2023)

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DOI: 10.1109/TASE.2022.3178986

access: closed

type: Journal Article

metadata version: 2023-04-29

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  - https://dblp.org/rec/journals/tase/YeLJPYZ23
Shuyuan Ye, Zhili Long, Jianzhong Ju, Tianyu Peng, Jun Yin, Heng Zhao:
Toward Ultrasonic Wire Bonding for High Power Device: A Vector Based Resonant Frequency Tracking and Constant Amplitude Control. IEEE Trans Autom. Sci. Eng. 20(2): 1337-1348 (2023)

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