• case-insensitive prefix search: default
  e.g., sig matches "SIGIR" as well as "signal"
• exact word search: append dollar sign ($) to word
  e.g., graph$ matches "graph", but not "graphics"
• boolean and: separate words by space
  e.g., codd model
• boolean or: connect words by pipe symbol (|)
  e.g., graph|network

Update May 7, 2017: Please note that we had to disable the phrase search operator (.) and the boolean not operator (-) due to technical problems. For the time being, phrase search queries will yield regular prefix search result, and search terms preceded by a minus will be interpreted as regular (positive) search terms.

found 28 matches

• 2024
• 
  Yousef Safari, Yushu Zhao, Boris Vaisband:
  Co-DTC: Concentric Trench-Based Integrated Capacitors for Advanced Chiplet-Based Platforms. ACM Great Lakes Symposium on VLSI 2024: 1-6
• 
  Inna Partin-Vaisband, Srinivas Katkoori, Lu Peng, Boris Vaisband, Tooraj Nikoubin:
  Proceedings of the Great Lakes Symposium on VLSI 2024, GLSVLSI 2024, Clearwater, FL, USA, June 12-14, 2024. ACM 2024 [contents]
• 2023
• 
  Mousa Karimi, Ataollah Saeed Monir, Rezvan Mohammadrezaee, Boris Vaisband:
  CTT-Based Scalable Neuromorphic Architecture. IEEE J. Emerg. Sel. Topics Circuits Syst. 13(1): 96-107 (2023)
• 
  Yousef Safari, Boris Vaisband:
  A Robust Integrated Power Delivery Methodology for 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 31(3): 287-295 (2023)
• 
  Yousef Safari, Pooya Aghanoury, Subramanian S. Iyer, Nader Sehatbakhsh, Boris Vaisband:
  Hybrid Obfuscation of Chiplet-Based Systems. DAC 2023: 1-6
• 
  Samuel Dayo, Ataollah Saeed Monir, Mousa Karimi, Boris Vaisband:
  Statistical Weight Refresh System for CTT-Based Synaptic Arrays. ACM Great Lakes Symposium on VLSI 2023: 213-214
• 
  Okyanus T. Gumus, Mousa Karimi, Boris Vaisband:
  Digital LIF Neuron for CTT-Based Neuromorphic Systems. ACM Great Lakes Symposium on VLSI 2023: 267-272
• 
  Dima Al Saleh, Yousef Safari, Fahad Rahman Amik, Boris Vaisband:
  P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs. SOCC 2023: 1-6
• 2022
• 
  Mousa Karimi, Mohamed Ali, Ahmad Hassan, Reza Bostani, Boris Vaisband, Mohamad Sawan, Benoit Gosselin:
  A 7.6-ns Delay Subthreshold Level-Shifter Leveraging a Composite Transistor and a Voltage-Controlled Current Source. IEEE Access 10: 132432-132447 (2022)
• 
  Yousef Safari, Anja Kroon, Boris Vaisband:
  Power Delivery for Ultra-Large-Scale Applications on Si-IF. ISCAS 2022: 1605-1609
• 
  Yousef Safari, Boris Vaisband:
  Integrated Power Delivery Methodology for 3D ICs. ISQED 2022: 114-119
• 
  Yousef Safari, Anja Kroon, Boris Vaisband:
  Power Delivery for Ultra-Large-Scale Applications on Si-IF. CoRR abs/2208.13034 (2022)
• 2021
• 
  Yousef Safari, Boris Vaisband:
  Power Delivery for Silicon Interconnect Fabric. ISCAS 2021: 1-5
• 2020
• 
  Boris Vaisband, Ange Maurice, Chong Wei Tan, Beng Kang Tay, Eby G. Friedman:
  Multi-Bit CNT TSV for 3-D ICs. ISCAS 2020: 1-5
• 2019
• 
  Subramanian S. Iyer, SivaChandra Jangam, Boris Vaisband:
  Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems. IBM J. Res. Dev. 63(6): 5:1-5:16 (2019)
• 
  Kannan K. Thankappan, Adeel Ahmad Bajwa, Boris Vaisband, SivaChandra Jangam, Subramanian S. Iyer:
  Reliability Evaluation of Silicon Interconnect Fabric Technology. IRPS 2019: 1-5
• 
  Boris Vaisband, Subramanian S. Iyer:
  Global and semi-global communication on Si-IF. NOCS 2019: 15:1-15:5
• 
  Boris Vaisband, Subramanian S. Iyer:
  Communication Considerations for Silicon Interconnect Fabric. SLIP 2019: 1-6
• 2018
• 
  Boris Vaisband, Eby G. Friedman:
  Heterogeneous 3-D ICs as a platform for hybrid energy harvesting in IoT systems. Future Gener. Comput. Syst. 87: 152-158 (2018)
• 
  Boris Vaisband, Adeel Ahmad Bajwa, Subramanian S. Iyer:
  Network on interconnect fabric. ISQED 2018: 138-143
• 2017
• 
  Boris Vaisband, Eby G. Friedman:
  Hexagonal TSV Bundle Topology for 3-D ICs. IEEE Trans. Circuits Syst. II Express Briefs 64-II(1): 11-15 (2017)
• 
  Boris Vaisband, Eby G. Friedman:
  Hybrid energy harvesting in 3-D IC IoT devices. ISCAS 2017: 1-4
• 2016
• 
  Boris Vaisband, Eby G. Friedman:
  Noise Coupling Models in Heterogeneous 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 24(8): 2778-2786 (2016)
• 
  Boris Vaisband, Eby G. Friedman:
  Layer ordering to minimize TSVs in heterogeneous 3-D ICs. ISCAS 2016: 1926-1929
• 2015
• 
  Inna Vaisband, Mahmoud Saadat, Boris Murmann:
  A Closed-Loop Reconfigurable Switched-Capacitor DC-DC Converter for Sub-mW Energy Harvesting Applications. IEEE Trans. Circuits Syst. I Regul. Pap. 62-I(2): 385-394 (2015)
• 
  Ioannis Savidis, Boris Vaisband, Eby G. Friedman:
  Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits. IEEE Trans. Very Large Scale Integr. Syst. 23(10): 2077-2089 (2015)
• 
  Boris Vaisband, Eby G. Friedman:
  3-D floorplanning algorithm to minimize thermal interactions. ISCAS 2015: 2133-2136
• 2014
• 
  Boris Vaisband, Ioannis Savidis, Eby G. Friedman:
  Thermal conduction path analysis in 3-D ICs. ISCAS 2014: 594-597