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ORCIDYasushi Yamada
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2010 – 2019
- 2016
[j9]Toshitaka Ishizaki
, Daiki Miura, Atsuki Kuno, Ryota Nagao, Syoho Aoki, Yuta Ohshima, Takuma Kino, Masanori Usui, Yasushi Yamada:
Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. Microelectron. Reliab. 64: 287-293 (2016)- [j8]Yasushi Yamada, Masashi Yanase, Daiki Miura, Katsuhiro Chikuba:
Novel heatsink for power semiconductor module using high thermal conductivity graphite. Microelectron. Reliab. 64: 484-488 (2016) - 2015
- [j7]Toshitaka Ishizaki, Masashi Yanase, A. Kuno, T. Satoh, Masanori Usui, F. Osawa, Yasushi Yamada:
Thermal simulation of joints with high thermal conductivities for power electronic devices. Microelectron. Reliab. 55(7): 1060-1066 (2015) - 2014
- [j6]Fumiaki Osawa, Kazunori Kanou, Yasushi Yamada:
Research on the Form Recognition of Fabric Products: Acquiring the Shapes of Flat, Limp Materials. Int. J. Autom. Technol. 8(6): 880-887 (2014) - [j5]Toshitaka Ishizaki, A. Kuno, A. Tane, Masashi Yanase, F. Osawa, T. Satoh, Yasushi Yamada:
Reliability of Cu nanoparticle joint for high temperature power electronics. Microelectron. Reliab. 54(9-10): 1867-1871 (2014) - 2013
- [j4]Toshitaka Ishizaki, T. Satoh, A. Kuno, A. Tane, Masashi Yanase, F. Osawa, Yasushi Yamada:
Thermal characterizations of Cu nanoparticle joints for power semiconductor devices. Microelectron. Reliab. 53(9-11): 1543-1547 (2013) - 2012
- [j3]Yasushi Yamada:
Power semiconductor module using a bonding film with anisotropic thermal conduction. Microelectron. Reliab. 52(9-10): 2443-2446 (2012)
2000 – 2009
- 2007
- [j2]Yasushi Yamada, Yoshikazu Takaku, Yuji Yagi, Ikuo Nakagawa, Takashi Atsumi, Mikio Shirai, Ikuo Ohnuma, Kiyohito Ishida:
Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device. Microelectron. Reliab. 47(12): 2147-2151 (2007) - 2006
- [j1]Yasushi Yamada, Yoshikazu Takaku, Yuji Yagi, Y. Nishibe, Ikuo Ohnuma, Yuji Sutou, R. Kainuma, Kiyohito Ishida:
Pb-free high temperature solders for power device packaging. Microelectron. Reliab. 46(9-11): 1932-1937 (2006)
Coauthor Index
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