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2010 – 2019
- 2016
[c6]Francesco Ivaldi
, Tomasz Bieniek, Pawel Janus, Jerzy Zajac, Piotr Grabiec, Wojciech Majstrzyk, D. Kopiec, Teodor P. Gotszalk:
New approach for a multi-cantilever arrays sensor system with advanced MOEMS readout. ESSDERC 2016: 444-447- 2014
- [j3]Grzegorz Janczyk, Tomasz Bieniek, Jerzy Wasowski, Piotr Grabiec:
Investigation on reliability of interconnects in 3D heterogeneous systems by ageing beam resonance method. Microelectron. J. 45(7): 981-987 (2014) - [c5]Tomasz Bieniek, Grzegorz Janczyk, Magdalena Ekwinska, T. Budzynski, Piotr Gluszko, Piotr Grabiec, Andrzej Kociubinski:
Novel methodology for 3D MEMS-IC design and co-simulation on MEMS microphone smart system example. 3DIC 2014: 1-5 - [c4]Andrzej Kociubinski, M. Duk, Tomasz Bieniek, Grzegorz Janczyk, Michal Borecki:
Innovative SiC over Si photodiode based dual-band, 3D integrated detector. 3DIC 2014: 1-4 - 2013
- [c3]Tomasz Bieniek, Grzegorz Janczyk, Rafal Dobrowolski, Dariusz Szmigiel, Magdalena Ekwinska, Piotr Grabiec, Pawel Janus, Jerzy Zajac:
Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation. 3DIC 2013: 1-6 - 2011
- [j2]Stanislaw Kalicinski, Tomasz Bieniek, Pawel Janus, Piotr Grabiec:
Determination of electrical and mechanical parameters in capacitive MEMS accelerometers using electrical measurements. Microelectron. Reliab. 51(7): 1192-1197 (2011)
2000 – 2009
- 2009
- [c2]Grzegorz Janczyk, Tomasz Bieniek, Jerzy Szynka, Piotr Grabiec:
Reliability aspects of 3D-oriented heterogeneous device design related to stress sensitivity of MOS transistors. 3DIC 2009: 1-6 - 2008
- [j1]Grzegorz Janczyk, Tomasz Bieniek, Jerzy Szynka, Piotr Grabiec:
Reliability issues of e-Cubes heterogeneous system integration. Microelectron. Reliab. 48(8-9): 1133-1138 (2008) - [c1]Grzegorz Janczyk, Tomasz Bieniek:
The HDL and FE Thermal Modeling of Heterogeneous Systems. DDECS 2008: 128-131
Coauthor Index
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