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Wen-Kuan Yeh
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2020 – today
- 2020
- [c1]Wen Yang, Jiann-Shiun Yuan, Balakrishnan Krishnan, An-Jye Tzou, Wen-Kuan Yeh:
Substrate Bias Effect on Dynamic Characteristics of a Monolithically Integrated GaN Half-Bridge. IRPS 2020: 1-5
2010 – 2019
- 2019
- [j10]Wen-Teng Chang, Shih-Wei Lin, Min-Cheng Chen, Wen-Kuan Yeh:
Relationship of Channel and Surface Orientation to Mechanical and Electrical Stresses on N-Type FinFETs. IEICE Trans. Electron. 102-C(6): 429-434 (2019) - 2016
- [j9]Wenqi Zhang, Tzuo-Li Wang, Yan-hua Huang, Tsu-Ting Cheng, Shih-Yao Chen, Yiying Li, Chun-Hsiang Hsu, Chih-Jui Lai, Wen-Kuan Yeh, Yilin Yang:
Influence of fin number on hot-carrier injection stress induced degradation in bulk FinFETs. Microelectron. Reliab. 67: 89-93 (2016) - 2014
- [j8]Po-Ying Chen, Chi-Chang Chen, Wen-Kuan Yeh, Yukan Chang, Der-Chen Huang, Shyr-Shen Yu, Chwei-Shyong Tsai, Yu-Jung Huang, Wei-Cheng Lin, Shao-I Chu, Chung-Long Pan, Tsung-Hung Lin, Shyh-Chang Liu:
Using Capacitance Sensor to Extract Characteristic Signals of Dozing from Skin Surface. J. Sensors 2014: 238350:1-238350:7 (2014) - [j7]Wen-Teng Chang, Chun-Ming Lai, Wen-Kuan Yeh:
Reliability of the doping concentration in an ultra-thin body and buried oxide silicon on insulator (SOI) and comparison with a partially depleted SOI. Microelectron. Reliab. 54(2): 485-489 (2014) - 2013
- [j6]Wen-Kuan Yeh, Po-Ying Chen, Kwang-Jow Gan, Jer-Chyi Wang, Chao-Sung Lai:
The impact of interface/border defect on performance and reliability of high-k/metal-gate CMOSFET. Microelectron. Reliab. 53(2): 265-269 (2013) - 2011
- [j5]Jiann-Shiun Yuan, Wen-Kuan Yeh, Shuyu Chen, Chia-Wei Hsu:
NBTI reliability on high-k metal-gate SiGe transistor and circuit performances. Microelectron. Reliab. 51(5): 914-918 (2011) - 2010
- [j4]Chia-Wei Hsu, Yean-Kuen Fang, Wen-Kuan Yeh, Chun-Yu Chen, Yen-Ting Chiang, Feng-Renn Juang, Chien-Ting Lin, Chieh-Ming Lai:
Improvement of TDDB reliability, characteristics of HfO2 high-k/metal gate MOSFET device with oxygen post deposition annealing. Microelectron. Reliab. 50(5): 618-621 (2010) - [j3]Jiann-Shiun Yuan, J. Ma, Wen-Kuan Yeh, Chia-Wei Hsu:
Impact of strain on hot electron reliability of dual-band power amplifier and integrated LNA-mixer RF performances. Microelectron. Reliab. 50(6): 807-812 (2010)
2000 – 2009
- 2008
- [j2]Chia-Wei Hsu, Yean-Kuen Fang, Wen-Kuan Yeh, Chien-Ting Lin:
Significantly improving sub-90 nm CMOSFET performances with notch-gate enhanced high tensile-stress contact etch stop layer. Microelectron. Reliab. 48(11-12): 1791-1794 (2008) - 2007
- [j1]Chieh-Ming Lai, Yean-Kuen Fang, Chien-Ting Lin, Chia-Wei Hsu, Wen-Kuan Yeh:
The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs. Microelectron. Reliab. 47(6): 944-952 (2007)
Coauthor Index
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