"Post-route alleviation of dense meander segments in high-performance ..."

Tsun-Ming Tseng et al. (2013)

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DOI: 10.1109/ICCAD.2013.6691193

access: closed

type: Conference or Workshop Paper

metadata version: 2019-09-25

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Tsun-Ming Tseng, Bing Li, Tsung-Yi Ho, Ulf Schlichtmann:
Post-route alleviation of dense meander segments in high-performance printed circuit boards. ICCAD 2013: 713-720

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