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"A novel soldering method to evaluate PCB pad cratering for pin-pull testing."
Miao Cai et al. (2013)
- Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang:
A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectron. Reliab. 53(9-11): 1568-1574 (2013)
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