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2020 – today
- 2023
[c1]R. Willems
, Evianne Kruithof, Koen L. P. M. Janssens, Matthijs J. M. Cluitmans, Olaf van der Sluis, Peter H. M. Bovendeerd, Clemens V. Verhoosel:
Isogeometric-Mechanics-Driven Electrophysiology Simulations of Ventricular Tachycardia. FIMH 2023: 97-106
2010 – 2019
- 2011
- [j15]Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P. H. M. Timmermans:
Design and implementation of flexible and stretchable systems. Microelectron. Reliab. 51(6): 1069-1076 (2011) - 2010
- [j14]Sander Noijen, Roy Engelen, Joerg Martens, Alexandru Opran, Olaf van der Sluis, Richard B. R. van Silfhout:
Prediction of the epoxy moulding compound aging effect on package reliability. Microelectron. Reliab. 50(7): 917-922 (2010) - [j13]Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont:
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50(9-11): 1654-1660 (2010)
2000 – 2009
- 2009
- [j12]Olaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang:
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. Microelectron. Reliab. 49(8): 853-860 (2009) - [j11]S. P. M. Noijen, Olaf van der Sluis, P. H. M. Timmermans, G. Q. Zhang:
Numerical prediction of failure paths at a roughened metal/polymer interface. Microelectron. Reliab. 49(9-11): 1315-1318 (2009) - 2008
- [j10]J. Thijsse, Olaf van der Sluis, J. A. W. van Dommelen, Willem D. van Driel, Marc G. D. Geers:
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus. Microelectron. Reliab. 48(3): 401-407 (2008) - [j9]Cadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang:
The need for multi-scale approaches in Cu/low-k reliability issues. Microelectron. Reliab. 48(6): 833-842 (2008) - 2007
- [j8]Marcel A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47(2-3): 179-186 (2007) - [j7]B. A. E. van Hal, Ron H. J. Peerlings, Marc G. D. Geers, Olaf van der Sluis:
Cohesive zone modeling for structural integrity analysis of IC interconnects. Microelectron. Reliab. 47(8): 1251-1261 (2007) - [j6]Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout:
Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectron. Reliab. 47(9-11): 1483-1491 (2007) - [j5]Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang:
Characterization of moisture properties of polymers for IC packaging. Microelectron. Reliab. 47(9-11): 1685-1689 (2007) - [j4]Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, Marcel A. J. van Gils:
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. Microelectron. Reliab. 47(12): 1975-1982 (2007) - 2006
- [j3]R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang:
Multiscale modelling of multilayer substrates. Microelectron. Reliab. 46(9-11): 1472-1477 (2006) - [j2]Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang:
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. 46(9-11): 1679-1684 (2006) - [j1]W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang:
Reliability modelling for packages in flexible end-products. Microelectron. Reliab. 46(9-11): 1880-1885 (2006)
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