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Andrew T. Yang
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2010 – 2019
- 2016
- [c17]Wei Wei, Andrew T. Yang, Weisong Shi
:
Security in Internet of Things: Opportunities and Challenges. IIKI 2016: 512-518
2000 – 2009
- 2004
- [c16]Shen Lin, Makoto Nagata
, Kenji Shimazaki, Kazuhiro Satoh, Masaya Sumita, Hiroyuki Tsujikawa, Andrew T. Yang:
Full-chip vectorless dynamic power integrity analysis and verification against 100uV/100ps-resolution measurement. CICC 2004: 509-512
1990 – 1999
- 1998
- [j6]Kevin J. Kerns, Andrew T. Yang:
Preservation of passivity during RLC network reduction via split congruence transformations. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 17(7): 582-591 (1998) - 1997
- [j5]Kevin J. Kerns, Andrew T. Yang:
Stable and efficient reduction of large, multiport RC networks by pole analysis via congruence transformations. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 16(7): 734-744 (1997) - [c15]Kevin J. Kerns, Andrew T. Yang:
Preservation of Passivity During RLC Network Reduction via Split Congruence Transformations. DAC 1997: 34-39 - 1996
- [c14]Kevin J. Kerns, Andrew T. Yang:
Stable and Efficient Reduction of Large, Multiport RC Networks by Pole Analysis via Congruence Transformations. DAC 1996: 280-285 - [c13]Steven D. Corey, Andrew T. Yang:
Automatic netlist extraction for measurement-based characterization of off-chip interconnect. ICCAD 1996: 24-29 - 1995
- [j4]Julie Chen, Andrew T. Yang:
STYLE: a statistical design approach based on nonparametric performance macromodeling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 14(7): 794-802 (1995) - [j3]Ivan L. Wemple, Andrew T. Yang:
Integrated circuit substrate coupling models based on Voronoi tessellation. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 14(12): 1459-1469 (1995) - [c12]Ivan L. Wemple, Andrew T. Yang:
Mixed-Signal Switching Noise Analysis Using Voronoi-Tessellated Substrate Macromodels. DAC 1995: 439-444 - [c11]Kevin J. Kerns, Ivan L. Wemple, Andrew T. Yang:
Stable and efficient reduction of substrate model networks using congruence transforms. ICCAD 1995: 207-214 - 1994
- [j2]Andrew T. Yang, Yu Liu, Jack T. Yao:
An efficient nonquasi-static diode model for circuit simulation. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 13(2): 231-239 (1994) - 1993
- [j1]Andrew T. Yang, Yu-Hsu Chang, Daniel G. Saab, Ibrahim N. Hajj:
Switch-level timing simulation of bipolar ECL circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 12(4): 516-530 (1993) - [c10]Andrew T. Yang, Yu Liu, Jack T. Yao, R. R. Daniels:
An Efficient Non-Quasi-Static Diode Model for Circuit Simulation. DAC 1993: 720-725 - [c9]Jack T. Yao, Andrew T. Yang:
A consistent nonlinear simulation environment based on improved harmonic balance techniques. EURO-DAC 1993: 90-95 - [c8]Julie Chen, Andrew T. Yang:
Style: a technology-independent approach to statistical design. ICCAD 1993: 210-214 - 1992
- [c7]Yu-Hsu Chang, Andrew T. Yang:
Analytic macromodeling and simulation fo tightly-coupled mixed analog-digital circuits. ICCAD 1992: 244-247 - 1991
- [c6]Andrew T. Yang, C. H. Chan, Jack T. Yao, R. R. Daniels, J. P. Harrang:
Modeling and Simulation of High-Frequency Integrated Circuits Based on Scattering Parameters. DAC 1991: 752-757 - [c5]Andrew T. Yang, Yu-Hsu Chang:
Bipolar Timing Modeling Including Interconnects Based on Parametric Correction. ICCAD 1991: 354-357 - [c4]Stanford S. Guillory, Daniel G. Saab, Andrew T. Yang:
Fault modeling and testing of self-timed circuits. VTS 1991: 62-66
1980 – 1989
- 1989
- [b1]Andrew T. Yang:
iSMILE: An integrated system for device model design, parameter extraction, and circuit simulation. University of Illinois Urbana-Champaign, USA, 1989 - [c3]Andrew T. Yang, S. M. Kang:
iSMILE: A Novel Circuit Simulation Program with Emphasis on New Device Model Development. DAC 1989: 630-633 - 1988
- [c2]Daniel G. Saab, Andrew T. Yang, Ibrahim N. Hajj:
Delay Modeling and Time of Bipolar Digital Circuits. DAC 1988: 288-293 - [c1]Andrew T. Yang, D. S. Gao, S. M. Kang:
Computer-aided simulation of optical interconnects for high-speed digital systems. ICCD 1988: 87-90
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