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Publication search results
found 24 matches
- 2023
- Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei:
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS 2023: 1-7 - Zsolt Zombori, Agapi Rissaki, Kristóf Szabó, Wolfgang Gatterbauer, Michael Benedikt:
Towards Unbiased Exploration in Partial Label Learning. CoRR abs/2307.00465 (2023) - 2021
- Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tökei, Kris Croes:
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. IRPS 2021: 1-6 - Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes:
Electromigration limits of copper nano-interconnects. IRPS 2021: 1-6 - 2020
- Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tökei, Kris Croes:
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. IRPS 2020: 1-6 - Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tökei, Kristof Croes:
Metal reliability mechanisms in Ruthenium interconnects. IRPS 2020: 1-7 - 2019
- Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tökei, Kristof Croes:
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. IRPS 2019: 1-6 - 2018
- Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tökei, Kristof Croes:
The first observation of p-type electromigration failure in full ruthenium interconnects. IRPS 2018: 6 - Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne:
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS 2018: 4 - Chen Wu, O. Varela Pedreira, Alicja Lesniewska, Yunlong Li, Ivan Ciofi, Zsolt Tökei, Kris Croes:
Insights into metal drift induced failure in MOL and BEOL. IRPS 2018: 3 - 2017
- Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei:
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79: 297-305 (2017) - 2016
- Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei:
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. Microelectron. Reliab. 56: 93-100 (2016) - Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei:
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. Microelectron. Reliab. 59: 102-107 (2016) - Gergely Dévay, Tibor Gregorics, Melinda Tóth, Domonkos Asztalos, Dávid János Németh, Gábor Ferenc Kovács, Boldizsár Németh, Zoltán Gera, András Dobreff, Balázs Gregorics, András Nagy, Martin Budai, Zsolt Kulik, Kristóf Kanyó:
txtUML. D&P@MoDELS 2016: 8-15 - 2015
- Kris Croes, Deniz Kocaay, Ivan Ciofi, Jürgen Bömmels, Zsolt Tökei:
Impact of process variability on BEOL TDDB lifetime model assessment. IRPS 2015: 5 - Kris Croes, Alicja Lesniewska, Chen Wu, Ivan Ciofi, Agnieszka Banczerowska, B. Briggs, S. Demuynck, Zsolt Tökei, Jürgen Bömmels, Y. Saad, W. Gao:
Intrinsic reliability of local interconnects for N7 and beyond. IRPS 2015: 2 - Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen:
Constant voltage electromigration for advanced BEOL copper interconnects. IRPS 2015: 2 - 2014
- István N. Huszár, Zsolt Mártonfalvi, András József Laki, Kristóf Iván, Miklós S. Z. Kellermayer:
Exclusion-Zone Dynamics Explored with Microfluidics and Optical Tweezers. Entropy 16(8): 4322-4337 (2014) - Baojun Tang, Kris Croes, Yohan Barbarin, Yunqi Wang, Robin Degraeve, Yunlong Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf:
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability. Microelectron. Reliab. 54(9-10): 1675-1679 (2014) - Julien Ryckaert, Praveen Raghavan, Rogier Baert, Marie Garcia Bardon, Mircea Dusa, Arindam Mallik, Sushil Sakhare, Boris Vandewalle, Piet Wambacq, Bharani Chava, Kris Croes, Morin Dehan, Doyoung Jang, Philippe Leray, Tsung-Te Liu, Kenichi Miyaguchi, Bertrand Parvais, Pieter Schuddinck, Philippe Weemaes, Abdelkarim Mercha, Jürgen Bömmels, Naoto Horiguchi, Greg McIntyre, Aaron Thean, Zsolt Tökei, Shaunee Cheng, Diederik Verkest, An Steegen:
Design Technology co-optimization for N10. CICC 2014: 1-8 - 2011
- Zsolt Lakatos, Lajos Bajzik, Tamás Kárász, Kristóf Bérczi, Erika R. Kovács, László A. Végh:
ILP based diverse path routing with node inclusion. ICUMT 2011: 1-8 - 2008
- Kristof Croes, G. Cannatá, L. Zhao, Zsolt Tökei:
Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle. Microelectron. Reliab. 48(8-9): 1384-1387 (2008) - Jin Guo, Antonis Papanikolaou, Michele Stucchi, Kristof Croes, Zsolt Tokei, Francky Catthoor:
A tool flow for predicting system level timing failures due to interconnect reliability degradation. ACM Great Lakes Symposium on VLSI 2008: 291-296 - 2006
- László Daragó, Pierre P. Lévy, Anett Veres, Zsolt Kristóf:
ICD-View: A Technique and Tool to Make the Morbidity Transparent. VIEW 2006: 216-224
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