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2020 – today
- 2020
[c28]Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tokei, Kris Croes:
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. IRPS 2020: 1-6- [c27]Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi B. Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor:
Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects. IRPS 2020: 1-5 - [c26]Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tokei, Kristof Croes:
Metal reliability mechanisms in Ruthenium interconnects. IRPS 2020: 1-7 - [c25]Chen Wu, Adrian Chasin, Steven Demuynck, Naoto Horiguchi, Kris Croes:
Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects. IRPS 2020: 1-6 - [c24]A. Tsiara, S. A. Srinivasan, S. Balakrishnan, Marianna Pantouvaki, Philippe Absil, Joris Van Campenhout, Kris Croes:
Electrical and Optical Reliability Analysis of GeSi Electro-Absorption Modulators. OFC 2020: 1-3
2010 – 2019
- 2019
- [c23]Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tokei, Kristof Croes:
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. IRPS 2019: 1-6 - [c22]Kris Croes, Veerle Simons, Sofie Beyne, Vladimir Cherman, Herman Oprins, Michele Stucchi, Philippe Absil, A. Glabman, Eric Wilcox:
Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications. IRPS 2019: 1-4 - [c21]Norbert Herfurth, Anne Beyreuther, Elham Amini
, Christian Boit, Michél Simon-Najasek, Susanne Hübner, Frank Altmann, R. Herfurth, Chen Wu, I. De Wolf, Kris Croes:
New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis. IRPS 2019: 1-9 - [c20]Alicja Lesniewska, S. A. Srinivasan, Joris Van Campenhout, Barry J. O'Sullivan, Kris Croes:
Accelerated Device Degradation of High-Speed Ge Waveguide Photodetectors. IRPS 2019: 1-7 - [c19]Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi Baradaran Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor:
Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects. IRPS 2019: 1-6 - [c18]Chen Wu, Adrian Chasin, Andrea Padovani, Alicja Lesniewska, Steven Demuynck, Kris Croes:
Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects. IRPS 2019: 1-6 - 2018
- [c17]Chen Wu, O. Varela Pedreira, Alicja Lesniewska, Yunlong Li, Ivan Ciofi, Zsolt Tokei, Kris Croes:
Insights into metal drift induced failure in MOL and BEOL. IRPS 2018: 3 - [c16]Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, M. Gonzalez, Ingrid De Wolf, Zsolt Tokei, Eric Beyne:
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS 2018: 4 - [c15]Yunlong Li, Michele Stucchi, Stefaan Van Huylenbroeck, Geert Van der Plas, Gerald Beyer, Eric Beyne, Kristof Croes:
TSV process-induced MOS reliability degradation. IRPS 2018: 5 - [c14]Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tokei, Kristof Croes:
The first observation of p-type electromigration failure in full ruthenium interconnects. IRPS 2018: 6 - [c13]Deniz Kocaay, Philippe Roussel, Kristof Croes, Ivan Ciofi, Alicja Lesniewska, Ingrid De Wolf:
Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing. IRPS 2018: 10-1 - [c12]Joris Van Campenhout, Yoojin Ban, Peter De Heyn, Ashwyn Srinivasan, Jeroen De Coster, Sebastien Lardenois, Brad Snyder, Sadhishkumar Balakrishnan, Guy Lepage, Negin Golshani, Sofie Janssen, Alicja Lesniewska, Kristof Croes, Andy Miller, Peter Verheyen, Marianna Pantouvaki, Philippe Absil:
Silicon Photonics for 56G NRZ Optical Interconnects. OFC 2018: 1-3 - 2017
- [j19]Deniz Kocaay, Philippe Roussel, Kris Croes, Ivan Ciofi, Y. Saad, Ingrid De Wolf:
LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration. Microelectron. Reliab. 76-77: 131-135 (2017) - [j18]Kristof J. P. Jacobs, T. Wang, Michele Stucchi, Mario Gonzalez, Kris Croes, Ingrid De Wolf, Eric Beyne:
Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices. Microelectron. Reliab. 76-77: 188-193 (2017) - [j17]Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tokei:
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79: 297-305 (2017) - 2016
- [j16]Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne:
Reliability Challenges Related to TSV Integration and 3-D Stacking. IEEE Des. Test 33(3): 37-45 (2016) - [j15]Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tokei:
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. Microelectron. Reliab. 56: 93-100 (2016) - [j14]Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tokei:
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. Microelectron. Reliab. 59: 102-107 (2016) - 2015
- [j13]Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf:
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. Microelectron. Reliab. 55(5): 765-770 (2015) - [c11]Kris Croes, Alicja Lesniewska, Chen Wu, Ivan Ciofi, Agnieszka Banczerowska, B. Briggs, S. Demuynck, Zsolt Tokei, Jürgen Bömmels, Y. Saad, W. Gao:
Intrinsic reliability of local interconnects for N7 and beyond. IRPS 2015: 2 - [c10]Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tokei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen:
Constant voltage electromigration for advanced BEOL copper interconnects. IRPS 2015: 2 - [c9]Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, P. Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes:
Impact of oxide liner properties on TSV Cu pumping and TSV stress. IRPS 2015: 4 - [c8]Kris Croes, Deniz Kocaay, Ivan Ciofi, Jürgen Bömmels, Zsolt Tokei:
Impact of process variability on BEOL TDDB lifetime model assessment. IRPS 2015: 5 - 2014
- [j12]Baojun Tang, Kris Croes, Y. Barbarin, Y. Q. Wang, Robin Degraeve, Y. Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tokei, Ingrid De Wolf:
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability. Microelectron. Reliab. 54(9-10): 1675-1679 (2014) - [j11]Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne, Ingrid De Wolf, Kristof Croes:
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias. Microelectron. Reliab. 54(9-10): 1949-1952 (2014) - [c7]Julien Ryckaert, Praveen Raghavan, Rogier Baert, Marie Garcia Bardon, M. Dusa, Arindam Mallik, Sushil Sakhare, B. Vandewalle, Piet Wambacq, Bharani Chava, Kris Croes, Morin Dehan, Doyoung Jang, P. Leray, T.-T. Liu, Kenichi Miyaguchi, Bertrand Parvais, P. Schuddinck, P. Weemaes, Abdelkarim Mercha, Jürgen Bömmels, N. Horiguchi, G. McIntyre, Aaron Thean, Zsolt Tokei, S. Cheng, Diederik Verkest, A. Steegen:
Design Technology co-optimization for N10. CICC 2014: 1-8 - 2013
- [c6]Arindam Mallik, Paul Zuber, Tsung-Te Liu, Bharani Chava, Bhavana Ballal, Pablo Royer Del Bario, Rogier Baert, Kris Croes, Julien Ryckaert, Mustafa Badaroglu, Abdelkarim Mercha, Diederik Verkest:
TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes. DAC 2013: 24:1-24:6 - 2012
- [j10]B. Dimcic, Riet Labie, Joke De Messemaeker, Kris Vanstreels, Kris Croes, Bert Verlinden, Ingrid De Wolf:
Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures. Microelectron. Reliab. 52(9-10): 1971-1974 (2012) - 2011
- [j9]Melina Lofrano, Kris Croes, Ingrid De Wolf, Christopher J. Wilson:
Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach. Microelectron. Reliab. 51(9-11): 1578-1581 (2011) - [j8]Ingrid De Wolf, Kris Croes, O. Varela Pedreira, Riet Labie, Augusto Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne:
Cu pumping in TSVs: Effect of pre-CMP thermal budget. Microelectron. Reliab. 51(9-11): 1856-1859 (2011)
2000 – 2009
- 2009
- [c5]Dragomir Milojevic, Trevor E. Carlson, Kris Croes, Riko Radojcic, Diana F. Ragett, Dirk Seynhaeve, Federico Angiolini, Geert Van der Plas, Paul Marchal:
Automated Pathfinding tool chain for 3D-stacked integrated circuits: Practical case study. 3DIC 2009: 1-6 - 2008
- [j7]Kristof Croes, G. Cannatá, L. Zhao, Zsolt Tokei:
Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle. Microelectron. Reliab. 48(8-9): 1384-1387 (2008) - [c4]Jin Guo, Antonis Papanikolaou, Michele Stucchi, Kristof Croes, Zsolt Tokei, Francky Catthoor:
A tool flow for predicting system level timing failures due to interconnect reliability degradation. ACM Great Lakes Symposium on VLSI 2008: 291-296 - 2006
- [c3]Bjorn De Sutter, Bingfeng Mei, T. Andrei Bartic, Tom Vander Aa, Mladen Berekovic, Jean-Yves Mignolet, Kris Croes, Paul Coene, Miro Cupac, Aïssa Couvreur, Andy Folens, Steven Dupont, Bert Van Thielen, Andreas Kanstein, Hong-Seok Kim, Sukjin Kim:
Hardware and a Tool Chain for ADRES. ARC 2006: 425-430 - 2002
- [j6]E. Andries, R. Dreesen, Kris Croes, Ward De Ceuninck, Luc De Schepper, Guido Groeseneken, K. F. Lo, Marc D'Olieslaeger, Jan D'Haen:
Statistical aspects of the degradation of LDD nMOSFETs. Microelectron. Reliab. 42(9-11): 1409-1413 (2002) - [j5]Stefano Aresu, Ward De Ceuninck, R. Dreesen, Kris Croes, E. Andries, Jean Manca, Luc De Schepper, Robin Degraeve, Ben Kaczer, Marc D'Olieslaeger:
High-resolution SILC measurements of thin SiO2 at ultra low voltages. Microelectron. Reliab. 42(9-11): 1485-1489 (2002) - 2001
- [j4]R. Dreesen, Kris Croes, Jean Manca, Ward De Ceuninck, Luc De Schepper, A. Pergoot, Guido Groeseneken:
A new degradation model and lifetime extrapolation technique for lightly doped drain nMOSFETs under hot-carrier degradation. Microelectron. Reliab. 41(3): 437-443 (2001) - [j3]Kris Croes, R. Dreesen, Jean Manca, Ward De Ceuninck, Luc De Schepper, Luc Tielemans, P. J. van der Wel:
High-resolution in-situ of gold electromigration: test time reduction. Microelectron. Reliab. 41(9-10): 1439-1442 (2001)
1990 – 1999
- 1999
- [j2]Diederik Verkest, Julio Leao da Silva Jr., Chantal Ykman-Couvreur, Kris Croes, Miguel Miranda, Sven Wuytack, Francky Catthoor, Gjalt G. de Jong, Hugo De Man:
Matisse: A System-on-Chip Design Methodology Emphasizing Dynamic Memory Management. J. VLSI Signal Process. 21(3): 185-194 (1999) - 1998
- [c2]Julio Leao da Silva Jr., Chantal Ykman-Couvreur, Miguel Miranda, Kris Croes, Sven Wuytack, Gjalt G. de Jong, Francky Catthoor, Diederik Verkest, Paul Six, Hugo De Man:
Efficient System Exploration and Synthesis of Applications with Dynamic Data Storage and Intensive Data Transfer. DAC 1998: 76-81
1980 – 1989
- 1989
- [j1]I. Vandeweerd, Kris Croes, Luc Rijnders, Paul Six, Hugo De Man:
REDUSA: module generation by automatic elimination of superfluous blocks in regular structures. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 8(9): 989-998 (1989) - [c1]I. Vandeweerd, Kris Croes, Luc Rijnders, Paul Six, Hugo De Man:
REDUSA: Module Generation by Automatic Elimination of Superfluous Blocks in Regular Structures. DAC 1989: 694-697
Coauthor Index
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