• case-insensitive prefix search: default
  e.g., sig matches "SIGIR" as well as "signal"
• exact word search: append dollar sign ($) to word
  e.g., graph$ matches "graph", but not "graphics"
• boolean and: separate words by space
  e.g., codd model
• boolean or: connect words by pipe symbol (|)
  e.g., graph|network

Update May 7, 2017: Please note that we had to disable the phrase search operator (.) and the boolean not operator (-) due to technical problems. For the time being, phrase search queries will yield regular prefix search result, and search terms preceded by a minus will be interpreted as regular (positive) search terms.

found 27 matches

• 2023
• 
  Marcos V. Conde, Eduard Zamfir, Radu Timofte, Daniel Motilla, Cen Liu, Zexin Zhang, Yunbo Peng, Yue Lin, Jiaming Guo, Xueyi Zou, Yuyi Chen, Yi Liu, Jia Hao, Youliang Yan, Yuanfan Zhang, Gen Li, Lei Sun, Lingshun Kong, Haoran Bai, Jinshan Pan, Jiangxin Dong, Jinhui Tang, Mustafa Ayazoglu, Bahri Batuhan Bilecen, Mingxi Li, Yuhang Zhang, Xianjun Fan, Yankai Sheng, Long Sun, Zibin Liu, Weiran Gou, Shaoqing Li, Ziyao Yi, Yan Xiang, Dehui Kong, Ke Xu, Ganzorig Gankhuyag, Kihwan Yoon, Jin Zhang, Gaocheng Yu, Feng Zhang, Hongbin Wang, Zhou Zhou, Jiahao Chao, Hongfan Gao, Jiali Gong, Zhengfeng Yang, Zhenbing Zeng, Chengpeng Chen, Zichao Guo, Anjin Park, Yuqing Liu, Qi Jia, Hongyuan Yu, Xuanwu Yin, Dongyang Zhang, Ting Fu, Zhengxue Cheng, Shiai Zhu, Dajiang Zhou, Weichen Yu, Lin Ge, Jiahua Dong, Yajun Zou, Zhuoyuan Wu, Binnan Han, Xiaolin Zhang, Heng Zhang, Ben Shao, Shaolong Zheng, Daheng Yin, Baijun Chen, Mengyang Liu, Marian-Sergiu Nistor, Yi-Chung Chen, Zhi-Kai Huang, Yuan-Chun Chiang, Wei-Ting Chen, Hao-Hsiang Yang, Hua-En Chang, I-Hsiang Chen, Chia-Hsuan Hsieh, Sy-Yen Kuo, Tu Vo, Qingsen Yan, Yun Zhu, Jinqiu Su, Yanning Zhang, Cheng Zhang, Jiaying Luo, Youngsun Cho, Nakyung Lee, Kunlong Zuo:
  Efficient Deep Models for Real-Time 4K Image Super-Resolution. NTIRE 2023 Benchmark and Report. CVPR Workshops 2023: 1495-1521
• 
  Florin-Alexandru Vasluianu, Tim Seizinger, Radu Timofte, Shuhao Cui, Junshi Huang, Shuman Tian, Mingyuan Fan, Jiaqi Zhang, Li Zhu, Xiaoming Wei, Xiaolin Wei, Ziwei Luo, Fredrik K. Gustafsson, Zheng Zhao, Jens Sjölund, Thomas B. Schön, Xiaoyi Dong, Xi Sheryl Zhang, Chenghua Li, Cong Leng, Woon-Ha Yeo, Wang-Taek Oh, Yeoreum Lee, Han-Cheol Ryu, Jinting Luo, Chengzhi Jiang, Mingyan Han, Qi Wu, Wenjie Lin, Lei Yu, Xinpeng Li, Ting Jiang, Haoqiang Fan, Shuaicheng Liu, Shuning Xu, Binbin Song, Xiangyu Chen, Shile Zhang, Jiantao Zhou, Zhao Zhang, Suiyi Zhao, Huan Zheng, Yangcheng Gao, Yanyan Wei, Bo Wang, Jiahuan Ren, Yan Luo, Yuki Kondo, Riku Miyata, Fuma Yasue, Taito Naruki, Norimichi Ukita, Hua-En Chang, Hao-Hsiang Yang, Yi-Chung Chen, Yuan-Chun Chiang, Zhi-Kai Huang, Wei-Ting Chen, I-Hsiang Chen, Chia-Hsuan Hsieh, Sy-Yen Kuo, Xianwei Li, Huiyuan Fu, Chunlin Liu, Huadong Ma, Binglan Fu, Huiming He, Mengjia Wang, Wenxuan She, Yu Liu, Sabari Nathan, Priya Kansal, Zhongjian Zhang, Huabin Yang, Yan Wang, Yanru Zhang, Shruti S. Phutke, Ashutosh Kulkarni, Md Raqib Khan, Subrahmanyam Murala, Santosh Kumar Vipparthi, Heng Ye, Zixi Liu, Xingyi Yang, Songhua Liu, Yinwei Wu, Yongcheng Jing, Qianhao Yu, Naishan Zheng, Jie Huang, Yuhang Long, Mingde Yao, Feng Zhao, Bowen Zhao, Nan Ye, Ning Shen, Yanpeng Cao, Tong Xiong, Weiran Xia, Dingwen Li, Shuchen Xia:
  NTIRE 2023 Image Shadow Removal Challenge Report. CVPR Workshops 2023: 1788-1807
• 
  An-Li Kuo, Po-Hsiang Wang, Hao-Wei Liu, Wei-Lung Tsai, Chia-Ning Hsu, Chien-Wen Lai, Yu-Chi Chang, Ching-Chiang Wu, Ken Wu:
  Color performance of 0.8 um CMOS image sensor with CMY color filters. Imaging Sensors and Systems 2023: 1-3
• 2022
• 
  Tzu-Ning Wen, Hsueh-Chun Lin, Kuo-Wei Yeh, Jing-Long Huang, Li-Chi Chiang:
  Effectiveness of eAsthmaCare on Symptoms, Childhood Asthma Control Test, and Lung Function among Asthmatic Children. J. Medical Syst. 46(11): 71 (2022)
• 
  Andrey Ignatov, Radu Timofte, Cheng-Ming Chiang, Hsien-Kai Kuo, Yu-Syuan Xu, Man-Yu Lee, Allen Lu, Chia-Ming Cheng, Chih-Cheng Chen, Jia-Ying Yong, Hong-Han Shuai, Wen-Huang Cheng, Zhuang Jia, Tianyu Xu, Yijian Zhang, Long Bao, Heng Sun, Diankai Zhang, Si Gao, Shaoli Liu, Biao Wu, Xiaofeng Zhang, Chengjian Zheng, Kaidi Lu, Ning Wang, Xiao Sun, Haodong Wu, Xuncheng Liu, Weizhan Zhang, Caixia Yan, Haipeng Du, Qinghua Zheng, Qi Wang, Wangdu Chen, Ran Duan, Mengdi Sun, Dan Zhu, Guannan Chen, Hojin Cho, Steve Kim, Shijie Yue, Chenghua Li, Zhengyang Zhuge, Wei Chen, Wenxu Wang, Yufeng Zhou, Xiaochen Cai, Hengxing Cai, Kele Xu, Li Liu, Zehua Cheng, Wenyi Lian, Wenjing Lian:
  Power Efficient Video Super-Resolution on Mobile NPUs with Deep Learning, Mobile AI & AIM 2022 Challenge: Report. ECCV Workshops (3) 2022: 130-152
• 
  Andrey Ignatov, Radu Timofte, Cheng-Ming Chiang, Hsien-Kai Kuo, Yu-Syuan Xu, Man-Yu Lee, Allen Lu, Chia-Ming Cheng, Chih-Cheng Chen, Jia-Ying Yong, Hong-Han Shuai, Wen-Huang Cheng, Zhuang Jia, Tianyu Xu, Yijian Zhang, Long Bao, Heng Sun, Diankai Zhang, Si Gao, Shaoli Liu, Biao Wu, Xiaofeng Zhang, Chengjian Zheng, Kaidi Lu, Ning Wang, Xiao Sun, Haodong Wu, Xuncheng Liu, Weizhan Zhang, Caixia Yan, Haipeng Du, Qinghua Zheng, Qi Wang, Wangdu Chen, Ran Duan, Ran Duan, Mengdi Sun, Dan Zhu, Guannan Chen, Hojin Cho, Steve Kim, Shijie Yue, Chenghua Li, Zhengyang Zhuge, Wei Chen, Wenxu Wang, Yufeng Zhou, Xiaochen Cai, Hengxing Cai, Kele Xu, Li Liu, Zehua Cheng, Wenyi Lian, Wenjing Lian:
  Power Efficient Video Super-Resolution on Mobile NPUs with Deep Learning, Mobile AI & AIM 2022 challenge: Report. CoRR abs/2211.05256 (2022)
• 2021
• 
  Samuel Liu, Jen-Ho Kuo, Luba Tang, Ning-Chi Huang, Der-Yu Tsai, M.-H. Yang, Kai-Chiang Wu:
  ONNC Compiler Used in Fault-Mitigating Mechanisms Analysis on NVDLA-Based and ReRAM-Based Edge AI Chip Design. VLSI-DAT 2021: 1-7
• 2017
• 
  Meng-Fan Chang, Chien-Chen Lin, Albert Lee, Yen-Ning Chiang, Chia-Chen Kuo, Geng-Hau Yang, Hsiang-Jen Tsai, Tien-Fu Chen, Shyh-Shyuan Sheu:
  A 3T1R Nonvolatile TCAM Using MLC ReRAM for Frequent-Off Instant-On Filters in IoT and Big-Data Processing. IEEE J. Solid State Circuits 52(6): 1664-1679 (2017)
• 2016
• 
  Meng-Fan Chang, Li-Yue Huang, Wen-Zhang Lin, Yen-Ning Chiang, Chia-Chen Kuo, Ching-Hao Chuang, Keng-Hao Yang, Hsiang-Jen Tsai, Tien-Fu Chen, Shyh-Shyuan Sheu:
  A ReRAM-Based 4T2R Nonvolatile TCAM Using RC-Filtered Stress-Decoupled Scheme for Frequent-OFF Instant-ON Search Engines Used in IoT and Big-Data Processing. IEEE J. Solid State Circuits 51(11): 2786-2798 (2016)
• 
  K.-C. Wu, Kuo-Ning Chiang:
  Characterization on acceleration-factor equation for packaging-solder joint reliability. Microelectron. Reliab. 65: 167-172 (2016)
• 
  Meng-Fan Chang, Ching-Hao Chuang, Yen-Ning Chiang, Shyh-Shyuan Sheu, Chia-Chen Kuo, Hsiang-Yun Cheng, John Sampson, Mary Jane Irwin:
  Designs of emerging memory based non-volatile TCAM for Internet-of-Things (IoT) and big-data processing: A 5T2R universal cell. ISCAS 2016: 1142-1145
• 2014
• 
  Hsueh-Chun Lin, Li-Chi Chiang, Tzu-Ning Wen, Kuo-Wei Yeh, Jing-Long Huang:
  Development of online diary and self-management system on e-Healthcare for asthmatic children in Taiwan. Comput. Methods Programs Biomed. 116(3): 299-310 (2014)
• 2012
• 
  Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang:
  Light degradation test and design of thermal performance for high-power light-emitting diodes. Microelectron. Reliab. 52(5): 794-803 (2012)
• 2011
• 
  Tsung-Lin Chou, Shin-Yueh Yang, Chung-Jung Wu, Cheng-Nan Han, Kuo-Ning Chiang:
  Measurement and simulation of interfacial adhesion strength between SiO₂ thin film and III-V material. Microelectron. Reliab. 51(9-11): 1757-1761 (2011)
• 
  T. Y. Hung, S. Y. Chiang, C. J. Huang, Chang-Chun Lee, Kuo-Ning Chiang:
  Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test. Microelectron. Reliab. 51(9-11): 1819-1823 (2011)
• 2009
• 
  Tsung-Lin Chou, Chien-Fu Huang, Cheng-Nan Han, Shin-Yueh Yang, Kuo-Ning Chiang:
  Fabrication process simulation and reliability improvement of high-brightness LEDs. Microelectron. Reliab. 49(9-11): 1244-1249 (2009)
• 2008
• 
  Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Ming-Chih Yew, Wen-Kun Yang, Kuo-Ning Chiang:
  Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact. Microelectron. Reliab. 48(8-9): 1149-1154 (2008)
• 
  Hsiao-Tung Ku, Kuo-Ning Chiang:
  The mechanical stress resistance capability of stress buffer structures in analog devices. Microelectron. Reliab. 48(5): 716-723 (2008)
• 2007
• 
  C. C. Chiu, H. H. Chang, Chang-Chun Lee, C. C. Hsia, Kuo-Ning Chiang:
  Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure. Microelectron. Reliab. 47(9-11): 1506-1511 (2007)
• 
  Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang:
  Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. Microelectron. Reliab. 47(2-3): 196-204 (2007)
• 
  Ming-Chih Yew, Chan-Yen Chou, Kuo-Ning Chiang:
  Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis. Microelectron. Reliab. 47(9-11): 1658-1662 (2007)
• 2006
• 
  Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang:
  Thermal resistance analysis and validation of flip chip PBGA packages. Microelectron. Reliab. 46(2-4): 440-448 (2006)
• 
  Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang:
  Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. Microelectron. Reliab. 46(12): 2104-2111 (2006)
• 
  Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang:
  Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectron. Reliab. 46(2-4): 523-534 (2006)
• 
  Ming-Chih Yew, C. Y. Chou, C. S. Huang, W. K. Yang, Kuo-Ning Chiang:
  The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis. Microelectron. Reliab. 46(9-11): 1874-1879 (2006)
• 2004
• 
  Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang:
  Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. Microelectron. Reliab. 44(4): 627-638 (2004)
• 2003
• 
  Kuo-Ming Chen, Kuo-Ning Chiang:
  Impact of probing procedure on flip chip reliability. Microelectron. Reliab. 43(1): 123-130 (2003)